Wettability of SAC305-coated Cu Fabricated by Low Temperature Process Using Ultrafine SAC305 Nanoparticles
نویسندگان
چکیده
منابع مشابه
Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging
In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of micro...
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This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Topside and Bottom-side of the boards. This data is for boards on the FR4-06 substrate. Isothermal storage at high temperature was used to accelerate the aging of the assembli...
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This paper presents the characterization of the mechanical properties of three lead-free solder alloys 95.5Sn-4.0Ag-0.5Cu (SAC405), 96.5Sn-3.0Ag-0.5Cu (SAC305), and 98.5Sn-1.0Ag-0.5Cu (SAC105) at the solder joint scale. Several actual ChipArray ball grid array (CABGA) packages were cross-sectioned, polished, and used as test vehicles. Compressive tests were performed using a nanocharacterizatio...
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15 صفحه اولUtilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint
The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi—pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, ...
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ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2015
ISSN: 1226-9360
DOI: 10.6117/kmeps.2015.22.3.025